Cadence Unveils AuraStack AI Super Agent to Automate PCB and Advanced Packaging Design

The AuraStack AI Super Agent coordinates domain-specific AI agents across planning, implementation, and integrated multiphysics analysis. By leveraging a unified foundation that concurrently models electrical, thermal, and mechanical behaviors—such as SI/PI, thermal, and mechanical stress—the platform enables real-time design convergence and optimization. According to company claims, the tool can reduce time to market by up to 50% and increase individual productivity by up to 15 times.

Several industry leaders are collaborating with Cadence to implement AuraStack workflows. NVIDIA is using the platform to automate complex system design workflows, while TSMC is partnering to accelerate advanced package implementation for multi-die systems. Other companies, including Socionext, FORVIA HELLA, and Schneider Electric, are also leveraging the technology to improve design efficiency and productivity.